3D EDS Microanalysis by FIB-SEM: limitations, potential and perspectives

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• Pierre Burdet, Interdisciplinary Centre for Electron Microscopy (CIME), Federal Institute of Technology of Lausanne (EPFL), Station 12, CH-1015 Lausanne, Switzerland
• Monday 25 June 2012, 15:00-16:00
• T001 [Tower Seminar Room], Materials Science and Metallurgy, Department of.

If you have a question about this talk, please contact Caterina Ducati.

FIB -Tomography combines FIB milling with the imaging capabilities and the variety of detection modes of a modern SEM in order to analyse the structure of a sample in 3 dimensions. Through fully automated slicing and imaging, it is possible to generate stacks of SEM images and EDS elemental maps. Hence, 3D EDS microanalysis provides low spatial resolution from SEM images and rich chemical information from EDS maps. Going from 2D EDS to 3D EDS leads to some specific limitations that are linked to time constraint and geometry. Besides, complex microstructure can be analysed; as an example of the technique potential, a laser weld between NiTi and stainless steel is characterized. The large scattering range of electrons in a bulk sample is the main limiting factor for spatial resolution. As a perspective, a new approach is presented to enhance quantification when limited by the scattering range.

This talk is part of the Electron Microscopy Group Seminars series.

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