Is the Future of Electronics Packaging in 3D Printing

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• Steve Riches - IMAPS UK Committee
• Tuesday 04 October 2016, 18:00-20:30
• Barclays Cambridge Maker Space, 7-8 Clifton Court, Cherry Hinton Road, Cambridge CB1 7BN.

If you have a question about this talk, please contact Steve Riches.

The revolution in additive manufacturing brought about by 3D printing is creating new opportunities for the manufacture of electronics products instead of standard surface mount assembly on printed circuit boards. The potential benefits include miniaturisation and improved performance through integration of the electronics within the structure of the component and truly flexible manufacturing for customisable products. IMAPS UK (International Microelectronics Assembly and Packaging Society) and Barclays Eagle Labs – Cambridge would like to invite you to an interactive workshop to hear about the advances in 3D printing for electronics and participate in defining the future challenges and opportunities for electronics design and manufacturing. Take this opportunity to discuss the future of electronics packaging, network amongst fellow practitioners and tour the recently established Eagle Labs Facility at Barclays Bank, Cherry Hinton Road, Cambridge. This event is free, please register at http://www.imaps-uk3d.eventbrite.co.uk

This talk is part of the Your personal list series.

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• Barclays Cambridge Maker Space, 7-8 Clifton Court, Cherry Hinton Road, Cambridge CB1 7BN

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