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Is the Future of Electronics Packaging in 3D Printing

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The revolution in additive manufacturing brought about by 3D printing is creating new opportunities for the manufacture of electronics products instead of standard surface mount assembly on printed circuit boards. The potential benefits include miniaturisation and improved performance through integration of the electronics within the structure of the component and truly flexible manufacturing for customisable products. IMAPS UK (International Microelectronics Assembly and Packaging Society) and Barclays Eagle Labs – Cambridge would like to invite you to an interactive workshop to hear about the advances in 3D printing for electronics and participate in defining the future challenges and opportunities for electronics design and manufacturing. Take this opportunity to discuss the future of electronics packaging, network amongst fellow practitioners and tour the recently established Eagle Labs Facility at Barclays Bank, Cherry Hinton Road, Cambridge. This event is free, please register at

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