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SUMMARY:Is the Future of Electronics Packaging in 3D Printing - Steve Rich
 es - IMAPS UK Committee
DTSTART:20161004T170000Z
DTEND:20161004T193000Z
UID:TALK67061@talks.cam.ac.uk
CONTACT:Steve Riches
DESCRIPTION:The revolution in additive manufacturing brought about by 3D p
 rinting is creating new opportunities for the manufacture of electronics p
 roducts instead of standard surface mount assembly on printed circuit boar
 ds. The potential benefits include miniaturisation and improved performanc
 e through integration of the electronics within the structure of the compo
 nent and truly flexible manufacturing for customisable products.\nIMAPS UK
  (International Microelectronics Assembly and Packaging Society) and Barcl
 ays Eagle Labs – Cambridge would like to invite you to an interactive wo
 rkshop to hear about the advances in 3D printing for electronics and parti
 cipate in defining the future challenges and opportunities for electronics
  design and manufacturing.\nTake this opportunity to discuss the future of
  electronics packaging\, network amongst fellow practitioners and tour the
  recently established Eagle Labs Facility at Barclays Bank\, Cherry Hinton
  Road\, Cambridge.\nThis event is free\, please register at http://www.ima
 ps-uk3d.eventbrite.co.uk\n\n
LOCATION:Barclays Cambridge Maker Space\, 7-8 Clifton Court\, Cherry Hinto
 n Road\, Cambridge CB1 7BN
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