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CATEGORIES:Monday Mechanics Seminars (DAMTP)
SUMMARY:Delamination of thin sheets from sticky substrates
  - Dominic Vella (DAMTP)
DTSTART;TZID=Europe/London:20081103T130500
DTEND;TZID=Europe/London:20081103T140000
UID:TALK14779AThttp://talks.cam.ac.uk
URL:http://talks.cam.ac.uk/talk/index/14779
DESCRIPTION:Thin sheets are adhered to substrates in a range o
 f practical  applications.  Traditionally the dela
 mination of these sheets is viewed as something to
  be avoided but in some microscopic applications i
 t can actually prove useful.  We consider two macr
 oscopic examples of the delamination of thin sheet
 s from sticky  substrates.  In the first example\,
  motivated by 'stretchable electronics'\, delamina
 tion is induced by the compression of a soft subst
 rate and gives rise to a series of blisters with a
  characteristic size.  We study this characteristi
 c size and consider the possible implications for 
 stretchable electronics techniques.  In the second
  example\, we take a new look at a classical adhes
 ion test - the 'Blister test'.  Using a thin liqui
 d layer as an adhesive we find new delamination pa
 tterns that we characterize theoretically. 
LOCATION:MR5\, CMS
CONTACT:Dr Ed Brambley
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